Testing products from unknown manufacturers is always a source for entertainment for all the sides involved. While the reviewer gains experience points and reader gets useful information, the maker is also served with its dose of adrenaline by hoping that the product leaves a positive first impression thus allowing the business to exist further down the road.
Today happens to be another one of such days when we see a new Korean memory player, called Essencore, make their first steps against such titans of the memory market as Corsair, G.Skill and Kingston. You probably haven't heard of Essencore either, but this is the maker behind the Klevv memory brand that has recently been making some noise in North America.
Klevv's current DDR3 menu contains Neo, Urbane and Genuine series in an ascending price order. Since we prefer to start our adventures at a low pace, today's test subject is an entry-level DDR3 model.
|Capacity||8 GB (2 x 4 GB)|
|Frequency||800 MHz (DDR3-1600)|
The kit in our hands is officially the slowest Klevv memory money can currently buy. Aside from a funky part number, there is absolutely nothing that would make it stand out from the sea of competitor 8GB dual-channel kits rated at DDR3-1600 CL9.
Having braced ourselves for some el-cheapo treatment, we were pleasantly surprised by the packaging. Using foam padding to protect the memory is something that very few memory makers currently do, let alone on the basic models. And yes, the box is much whiter than the stuff you usually see in toothpaste commercials.
The styling of the Neo series is rather different from what we are used to. There are no bright colours, there are no sharp edges, there are no godlike illuminated multi-level velociraptor RGB teeth sticking out of the modules. The smooth lines, the subtle details, the silver paintjob with a little shade of brown - it all looks very grown-up, and we like it.
Essencore's attention to detail doesn't stop with the looks. Unlike most of their competition who make use of thin stamped plates as a method of cooling, the aluminium heatsinks on the Evo are actually thick and heavy. Not only is it good from a standpoint of cooling, but it also solidifies our impression of the Neo as of a quality product.
The heatsinks attach to the modules by a strip of thermal glue on each of their sides. Pre-heated with a hairdryer to weaken the adhesive, they pose no threat of damage to anyone who attempts to remove them.
The memory chips used on our sample are manufactured by Hynix, also known as Hyundai Electronics. There are only eight chips on one of module's sides, the second side is left blank. As the modules are 4GB each, this means that each of the memory chips is of 512MB (or 4Gbit) capacity. This information can alternatively be deduced from the markings on the modules, which read H5TQ4G83MFR.
Of all the chip options that one can encounter on a 2015-made memory kit, Hynix MFR is, perhaps, the most favourable one due to its good voltage scaling and vast timing flexibility.
Both memory modules carry a small SPD chip, which contains their internal part number, serial number and production date. The SPD also features several JEDEC setting presets that are intended for backwards compatibility with platforms that do not support DDR3-1600 memory out of the box. On top of the JEDEC presets, there is an XMP - a profile intended to reduce the procedure of setting the memory to its rated frequency, timings and voltage to a change of just one option in motherboard's BIOS.
The exact settings applied by the XMP profile on our test platform were as follows: