Here at HWDb we are fairly familiar with Crucial's DDR4 offerings. In the recent past, we have tested both the Value and the Ballistix Sport representatives and both times we were impressed with the performance that the kits have delivered.
Last month, Crucial have made another step forward and finally unveiled the flagship Ballistix Elite. Naturally, we could not let this event go past without our immediate attention.
|Capacity||16 GB (4 x 4 GB)|
|Frequency||1333 MHz (DDR4-2666)|
(10 years in Germany and Austria)
At this point, the Ballistix Elite are available in as many as six capacity configurations: from single 4GB modules to quad-channel 32GB kits. There isn't as much choice when it comes to the remaining specs: all the current models are rated for DDR4-2666 at CL16.
These values might look lightweight compared to the competition, but keep in mind that Crucial have a long-lasting reputation for rating their memory way below its true capabilities. Hopefully, this is also the case with Ballistix Elite.
Like all its Crucial predecessors, the Ballistix Elite arrive to a potential customer packed in a transparent plastic box containing two trays with two memory modules each. There are no further accessories supplied with the kit.
Following the current trends in motherboard design, the Ballistix Elite feature an all-black appearance. We were about to praise Crucial for this solid good look but, truth be told, the modules look similar to most of their competitors.
The heatsinks on the Ballistix Elite are a three-piece job: two plates of metal collect heat on each side and then transfer it to the bar at the top of the modules. The whole thing is held together with a bunch of normal screws so if you are experiencing some clearance issues, the module height can easily be reduced.
Once you pick the modules off the table, you will immediately notice that they are quite heavy. And this surely is a good thing, as more weight means more metal in the heatsinks and more metal in the heatsinks means better cooling.
The plates attach to and collect the heat from the memory chips by the means of thermal tape covered in thermal adhesive. In theory, this solution is ought to work well, but in reality the strip of thermal tape is too narrow and the memory chips are not fully covered.
Speaking of the memory chips, on our sample they are to be found only on one side of the PCB. Because of the special markings printed by Crucial, we cannot identify their exact model, but we believe them to be Micron of 4Gbit capacity that belong to the D9RG_-family.
Each of the memory modules is flashed with an SPD, which contains information on its manufacturer, model and production date. The SPD also features several JEDEC setting presets that are primarily intended for backwards compatibility. On top of those, there is an XMP profile which will set the memory straight to its rated frequency and timings at a change of just one option in motherboard's BIOS.
For comparison purposes, below are the exact settings that our platform has applied after inserting the modules.